| Mfr Package Description | PLASTIC, DIP-64 |
| Microprocessor/Microcontroller/Peripheral IC Type | MICROPROCESSOR |
| Address Bus Width | 23.0 |
| Bit Size | 32 |
| Boundary Scan | NO |
| Clock Frequency-Max | 8.0 MHz |
| External Data Bus Width | 16.0 |
| Format | FIXED POINT |
| Integrated Cache | NO |
| JESD-30 Code | R-PDIP-T64 |
| JESD-609 Code | e0 |
| Low Power Mode | NO |
| Number of DMA Channels | 0.0 |
| Number of External Interrupts | 7.0 |
| Number of Serial I/Os | 0.0 |
| Number of Terminals | 64 |
| On Chip Data RAM Width | 0 |
| Operating Temperature-Min | 0.0 Cel |
| Operating Temperature-Max | 70.0 Cel |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | DIP |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Qualification Status | Not Qualified |
| RAM (words) | 0 |
| Seated Height-Max | 5.84 mm |
| Speed | 8.0 MHz |
| Supply Current-Max | 25.0 mA |
| Supply Voltage-Nom | 5.0 V |
| Supply Voltage-Min | 4.75 V |
| Supply Voltage-Max | 5.25 V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54 mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Length | 81.535 mm |
| Width | 22.86 mm |
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